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 HiPerFETTM Power MOSFETs Single Die MOSFET
N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low trr
VDSS IXFN 80N50 IXFN 75N50
D G S
ID25 80 A 75 A
RDS(on) 50 m 55 m
500 V 500 V
S
Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg VISOL Md Weight Symbol
Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C, Chip capability TC = 25C, pulse width limited by TJM TC = 25C 75N50 80N50 75N50 80N50
Maximum Ratings 500 500 20 30 75 80 300 320 80 V V V V A A A A A mJ J V/ns W C C C V~ V~
miniBLOC, SOT-227 B (IXFN) E153432
S G
S D
G = Gate S = Source
D = Drain
TC = 25C TC = 25C IS IDM, di/dt 100 A/s, VDD VDSS, TJ 150C, RG = 2 TC = 25C
64 6 5 700 -55 ... +150 150 -55 ... +150
Either Source terminal of miniBLOC can be used as Main or Kelvin Source
Features * International standard packages
* miniBLOC, with Aluminium nitride
isolation * Low RDS (on) HDMOSTM process
* Rugged polysilicon gate cell structure * Unclamped Inductive Switching (UIS)
rated
50/60 Hz, RMS IISOL 1 mA
t = 1 min t=1s
2500 3000
Mounting torque Terminal connection torque
1.5/13 Nm/lb.in. 1.5/13 Nm/lb.in. 30 g
* Low package inductance * Fast intrinsic Rectifier
Applications * DC-DC converters
Test Conditions
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 500 2 4 200 TJ = 25C TJ = 125C 80N50 75N50 100 2 50 55 V V nA A mA m m
* * * *
Battery chargers Switched-mode and resonant-mode power supplies DC choppers Temperature and lighting controls
VDSS VGH(th) IGSS IDSS RDS(on)
VGS = 0 V, ID = 3 mA VDS = VGS, ID = 8 mA VGS = 20 VDC, VDS = 0 VDS = VDSS VGS = 0 V V GS = 10 V, ID = 0.5 ID25 Pulse test, t 300 s, duty cycle d 2 %
Advantages * Easy to mount
* *
Space savings High power density
(c) 2002 IXYS All rights reserved
98538C (02/02)
IXFN 75N50 IXFN 80N50
Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 50 70 9890 VGS = 0 V, VDS = 25 V, f = 1 MHz 1750 460 61 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 RG = 1 (External), 70 102 27 380 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 80 173 0.18 0.05 S pF pF pF ns ns ns ns nC nC nC K/W K/W
A B C D E F G H J K L M N O P Q R S T U
miniBLOC, SOT-227 B
gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCK
VDS = 15 V; ID = 0.5 * ID25, pulse test
M4 screws (4x) supplied
Dim. Millimeter Min. Max. 31.50 7.80 4.09 4.09 4.09 14.91 30.12 38.00 11.68 8.92 0.76 12.60 25.15 1.98 4.95 26.54 3.94 4.72 24.59 -0.05 31.88 8.20 4.29 4.29 4.29 15.11 30.30 38.23 12.22 9.60 0.84 12.85 25.42 2.13 5.97 26.90 4.42 4.85 25.07 0.1 Inches Min. 1.240 0.307 0.161 0.161 0.161 0.587 1.186 1.496 0.460 0.351 0.030 0.496 0.990 0.078 0.195 1.045 0.155 0.186 0.968 -0.002 Max. 1.255 0.323 0.169 0.169 0.169 0.595 1.193 1.505 0.481 0.378 0.033 0.506 1.001 0.084 0.235 1.059 0.174 0.191 0.987 0.004
Source-Drain Diode Symbol IS ISM VSD t rr QRM IRM Test Conditions VGS = 0 V Repetitive; pulse width limited by TJM
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 75N50 80N50 75N50 80N50 75 80 300 320 1.3 250 1.2 8 A A A A V ns C A
IF = IS, VGS = 0 V, Pulse test, t 300 s, duty cycle d 2 % IF = 30A, -di/dt = 100 A/s, VR = 100 V
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715 5,381,025 6,306,728B1
IXFN 75N50 IXFN 80N50
Figure 1. Output Characteristics at 25OC
100
TJ = 25OC
Figure 2. Output Characteristics at 125OC
100
TJ = 125OC VGS = 9V 8V 7V 6V 5V
80
VGS = 9V 8V 7V 6V
80
ID - Amperes
ID - Amperes
60
5V
60 40 20
40 20
4V
4V
0
0 0 1 2 3 4 5 0 2 4 6 8 10
VDS - Volts
VDS - Volts
3.0 2.8 2.6
Figure 3. RDS(on) normalized to 0.5 ID25 value vs. ID
VGS = 10V
Figure 4. RDS(on) normalized to 0.5 ID25 value vs. TJ
2.8
VGS = 10V
RDS(ON) - Normalized
RDS(ON) - Normalized
TJ = 125 C
O
2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0 10 20 30 40 50 60 70 80
TJ = 25OC
2.5 2.2 1.9
ID =40A
ID = 80A
1.6 1.3 1.0 25
50
75
100
125
150
ID - Amperes
TJ - Degrees C
Figure 5. Drain Current vs. Case Temperature
100 80
Figure 6. Admittance Curves
50 40
ID - Amperes
60 40 20 0
ID - Amperes
30
TJ = 125oC
20
TJ = 25oC
10 0 4.0
-50
-25
0
25
50
75
100 125 150
4.5
5.0
5.5
6.0
6.5
7.0
7.5
TC - Degrees C
VGS - Volts
(c) 2002 IXYS All rights reserved
IXFN 75N50 IXFN 80N50
Figure 7. Gate Charge
10 8
VDS = 250 V ID = 40 A IG = 10 mA
Figure 8. Capacitance Curves
30000
10000
Ciss
6 4 2 0 0 50 100 150 200 250 300 350 400
Capacitance - pF
f = 100kHz
Coss
VGS - Volts
1000
Crss
100 0 5 10 15 20 25 30 35 40
Gate Charge - nC
VDS - Volts
Figure 9. Forward Voltage Drop of the Intrinsic Diode
100
VGS = 0V
80
ID - Amperes
TJ = 125OC
60
40
TJ = 25OC
20
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD - Volts
Figure 10. Transient Thermal Resistance
1.000
R(th)JC - K/W
0.100
Single Pulse
0.010
0.001 10-4
10-3
10-2
10-1
100
101
Pulse Width - Seconds
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715 5,381,025 6,306,728B1


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